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pcb design and development


Assembly of printed circuit board elements is a technological process of assembling electronic components on a dielectric base. The layout of insulating and conductive parts: capacitors, resistors, and indicators are applied to the surface of the printed circuit board. Holes were drilled through the mounting of chip components (ERE) and the installation of the module in the device case.

The set of components of pcb design and development depends on the purpose of the printed circuit board and the finished device. Before installation, the surface is prepared paste or glue is applied, grooves are drilled. To mechanically connect the elements, use spot welding. In the final stage of production – the dielectric is washed from the remnants of the reagent flux and a protective varnish is applied.

The decision on acceptance, rejection, revision or disposal of the product is made based on documents :

  • contract;
  • approved documentation;
  • agreed technical requirements.

A complete list of permissible defects and criteria for classifying products as defects is contained in the standards of the International Electrotechnical Commission.

Designing a printed circuit assembly solves a set of problems. The structural part includes the layout of the components (on a grid), fixing methods, the location of the holes, and the size of the technological fields.

When developing a module, technical issues are raised :

  • layer minimization;
  • tracing conductors;
  • calculation of parameters of communication lines and parasitic pickups;
  • heat dissipation and climatic conditions of work.

The technologist solves the issue of how to mount printed circuit boards to solve problems.

Regulatory documents provide for compliance with the standard or special regime. Ambient temperature is suitable for most operations: 18-30 °C. Relative humidity – less than 70%. When solder paste and flux are applied to the surface, the regulation recommends narrowing the range.